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mariner ic Inc.

The Mariner IC portfolio consists of two United States patents which relate to technology for incorporating metal structures in the corners and edges of semiconductor dies to prevent cracking from stresses.

 
Licensing Activities:
Current Licensing Programs:

 

Mariner IC Inc. v. Sharp Corporation

Mariner IC Inc. v. Huawei Device USA, Inc. et al

Completed Licensing Programs:

Mariner IC Inc. v. LG Electronics, Inc. et al

Mariner IC Inc. v. Panasonic Corporation

Mariner IC Inc. v. Texas Instruments Incorporated

Mariner IC Inc. v. MediaTek Inc. et al

Mariner IC Inc. v. Toshiba Corporation et al

Mariner IC Inc. v. TiVo Corporation

Mariner IC Inc. v. ASUSTeK Computer Inc.